The nVent SCHROFF CompactPCI Backplanes have best in class signal integrity and MTBF values due to SMD components, ceramics capacitors and press fit connectors.
Thông số kỹ thuật
- In accordance with: PICMG 2.0 R3.0 CompactPCI Core specification, PICMG 2.1 R2.0 Hot Swap specification, PICMG 2.9 R1.0 System Management Bus specification, PICMG 2.10 R1.0 Keying specification
- Digital GND can be connected to/isolated from chassis-GND by means of screws
- V(I/O) adjustable to +3.3 V or +5 V
- Infeed of supply voltages via powerbugs (ring tag M4), FASTONs
- Outer layers act as GND surfaces
- Utility plug for status signals (SMCQ)
- Multiple backplanes can be placed together without loss of slots
- ...Outstanding high-frequency noise suppression and very high MTBF values due to ceramic capacitors
- Intelligent platform management bus (IPMB) connector to PICMG 2.9
Xem thông số kỹ thuật đầy đủ tại đây => 23006-406
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